Pouch residual air reduction device

ABSTRACT

The present disclosure relates to removing residual air in a packaged product. In particular, the present disclosure is directed to a residual air reduction device and to methods of using such device to reduce the amount of residual air in a packaged product. Such a device is employed during the manufacturing process to release air trapped in a product matrix and/or in a head space of the package as the package contacts the device. In some embodiments, the device and methods of the disclosure are useful in reducing residual air in a pouch package by at least 5% in comparison to a pouch package manufactured without use of the device and/or methods described herein.

RELATED APPLICATIONS

This application claims priority to U.S. Patent App. Ser. No.62/035,232, entitled Pouch Residual Air Reduction Device, filed on Aug.8, 2014, the entire contents of which are incorporated herein byreference.

TECHNICAL FIELD

The present disclosure relates to the field of manufacturing pouchpackaged products. More particularly, the disclosure relates to methodsand devices useful for reducing residual air in a pouch product duringthe manufacturing process.

BACKGROUND

The manufacture of products that are packaged in pouch type packagingrequires the control of several parameters to achieve quality attributesof the finished product delivered to consumers. One of the most criticalparameters is residual air in the pouch after final sealing. Residualair can impact product appearance such that consumers perceive theproduct as spoiled. For example, residual air can change the color ofthe brown chunk surface of a pet food product to gray or green. Thisproduct appearance detriment is the result of oxidation reactionsinitiated by the presence of oxygen within the pouch that was notremoved during the manufacturing filling process. For this reason, it iscritical to reduce and control residual air contained within each pouchduring the filling process.

In general, the target for residual air in a pouch is less than 10%,more preferably less than 8%, still more preferably, less than 6%, evenmore preferably, less than 5%, 4%, 3%, 2%, 1%, or 0.5% of the totalpouch volume. Thus, in a pouch having a total volume of 100 cc, theresidual air would occupy 10 cc, 8 cc, 6 cc, 5 cc, 4 cc, 3 cc, 2 cc, 1cc, 0.5 cc, or less. Attempts to reduce residual air in a pouch includeusing mechanical devices such as vibratory or squeezing stations afterthe filling station. However, reaching a consistent solution throughmechanical devices has been very complex. Such attempts are hampered byspace restrictions, product design variables, synchronization with andintegration in the manufacturing process, and lengthy development andimplementation times. The removal of residual air through normalmechanical means is costly, labor intensive, and has limited success.

Accordingly, a need exists for a means of reducing pouch residual airduring the manufacturing process that is easy to integrate andsynchronize into various manufacturing processes and is alsocost-effective. It is also desired that the means of reducing pouchresidual air removes a significant amount of residual air during themanufacturing process.

SUMMARY

This summary describes several embodiments of the presently-disclosedsubject matter, and in many cases lists variations and permutations ofthese embodiments. This summary is merely exemplary of the numerous andvaried embodiments. Mention of one or more representative features of agiven embodiment is likewise exemplary. Such an embodiment can typicallyexist with or without the feature(s) mentioned; likewise, those featurescan be applied to other embodiments of the presently-disclosed subjectmatter, whether listed in this summary or not. To avoid excessiverepetition, this summary does not list or suggest all possiblecombinations of features. The present disclosure is directed toapparatus and devices for reducing the residual air during manufactureof pouch packaged products and methods for reducing such air. Inparticular, the present disclosure is directed to a device and methodsof using the device to reduce the residual air in a pouch package. Useof the device of the present disclosure reduces the residual air in apouch package at least 5%, 6%, 7%, 8%, or 9%, more preferably at least10%, 11%, 12%, 13%, or 14%, even more preferably at least 15%, 16%, 17%,18%, or 19%, even more preferably at least 20%, 21%, 22%, 23%, 24%, or25%, and still more preferably at least 26%, 27%, 28%, 29%, 30%, 31%,32%, 33%, 34%, 35%, 36%, 37%, 38%, 39%, or 40% compared to pouchpackaged products manufactured without using such device. Also, use ofthe device of the present disclosure reduces final product appearancedetriments caused by oxidation prior to consumer use.

“Residual air” refers to the air remaining in a package, such as apouch, after the product has been placed, filled, inserted, or depositedin the package and that would remain in the package after the packagecontaining the product was sealed. This air includes air remaining inthe head space of a package as well as air that is trapped in theproduct matrix as either a byproduct of the filling process or as abyproduct of the process of making the product.

The present disclosure provides devices for reducing the residual air ina pouch package during the manufacturing process. Such devices arepreferably employed in-line with the manufacturing process.

The residual air reducing devices of the present disclosure have a bumpsurface that contacts the pouch package as the pouch package passes thedevice during the manufacturing process. The residual air reducingdevices also have a plurality of alignment sides. Such alignment sidesprovide rigidity and stability to the bump surface. In some embodiments,the residual air reducing devices have a plurality of alignment sides.For example, some residual air reducing devices have first, second, andthird alignment sides. In some other embodiments, the residual airreducing devices have a first, second, third, and fourth alignmentsides. The dimensions of each alignment side depend upon the space inwhich the residual air reducing device will be employed.

The residual air reducing devices of the present disclosure include abump angle. The bump angle refers to the orientation of the bump surfacein relation to the first and second alignment sides and can be definedas the angle formed between a line perpendicular to the first alignmentside and a line parallel to the second alignment side. Suitable bumpangles may range between 10° and 85°. In some aspects, the bump angle ispreferably between 15° and 60°. In some aspects, the bump angle ispreferably between 25° and 50°. In some aspects, the bump angle ispreferably between about 25° and 35°, and is preferably about 30°. Inanother preferred aspect, the bump angle is between 25° and 65°. Inanother preferred aspect, the bump angle is between about 30° and 45°,and is preferably about 40°. Bump angles can be adjusted for differentproduct characteristics. For example, a chunk product in thick gravymight need a higher bump angle than a chunk product in thinner gravy. Ascan be seen, the bump angle includes a rise, which is the length of thebump surface between the first alignment side and the second alignmentside. Suitable rise lengths will depend on the space in which theresidual air reducing device will be employed. In general, it willinclude lengths between 5 mm and 100 mm. In one preferred aspect, therise length will be less than about 60 mm, and preferably between 30 mmand 60 mm. As with the bump angle, the rise length can vary depending onthe characteristics of the product in the pouch. In general, longer riselengths will be more effective for products with thinner liquids orgravies and shorter rise lengths will be more effective for productswith thicker liquids or gravies.

The residual air reducing devices of the present disclosure mayoptionally include at least one attachment flange. Such attachmentflanges include any means for attaching the residual air reducing deviceto the manufacturing line. In some embodiments, the flange will be agroove through which a plank will be seated. The plank can be a portionof the manufacturing line or can be attached to the manufacturing linefor the purpose of being inserted into the groove. In other embodiments,the flange will provide an attachment surface that extends beyond one ormore alignment sides and connects with the manufacturing line. Theattachment surface can then be secured to the manufacturing line usingconventional methods and fasteners.

The present disclosure also provides methods of reducing residual air ina pouch package using the devices described herein. Suitable methodsinclude employing at least one device of the present disclosure in themanufacturing line of a pouch packaged product. As the pouch passes bythe devices described herein during the course of proceeding down themanufacturing line, residual air is urged out of the pouch by contactingthe device.

Methods of the present disclosure provide reducing residual air in apouch package by contacting the package with a device of the presentdisclosure at a specific contact point. Suitable contact points includethe portion of the package containing the product such that air trappedin the product is released into the head space of the package. Suitablecontact points may also include those points that result in displacingthe air contained in the head space.

Further methods of the present disclosure provide reducing residual airin a package, such as a pouch package, by at least partially opening apackage. Generally this can be done by separating a first portion of thepackage from a second portion of the package in order to at leastpartially expose the inner part of the package such that it is able toreceive product. Multiple ways of opening various types of packages areknown in the art and incorporated herein. For example, a pouch packagemay be opened by inserting a nozzle into the top of the pouch andinjecting air therein in order to separate the sides of the package fromone another. A desired amount of product is inserted, deposited, placed,or injected into the opened pouch package in order to at least partiallyfill the package. As can be understood, the amount of product insertedinto the package can vary by intentional design, but it is understoodthat the package can be filled to any percentage of the total volume ofthe package including 5, 10, 15, 20, 25, 30, 35, 40, 45, 50, 55, 60, 65,70, 75, 80, 85, 90, 95, 100, or any percentage therebetween. The packageis then contacted with a first residual air reducing device to remove atleast some of the air therein prior to sealing the package. Any amountof air can be removed from the package, as described herein. In somepreferred forms, the package will also contact at least one moreresidual air reducing devices. As is known in the art, the package caneither be partially or completely sealed after the product has beeninserted therein and the package has contacted at least one residual airreducing device. The amount of sealing can vary as desired. In somepreferred forms, the package will be completely sealed, but in others,some amount, such as 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 15, 20, 25, 30, 35,40, 45, 50% or more, of the package may not be sealed.

Various objects and advantages of this process and its compositions willbecome apparent from the following description taken in conjunction withthe accompanying drawings which set forth, by way of illustration andexample, certain embodiments of the process and resulting compositions.

BRIEF DESCRIPTION OF THE DRAWINGS

The following drawings form part of the present specification and areincluded to further demonstrate certain aspects of the presentdisclosure. The disclosure may be better understood by reference to oneor more of these drawings in combination with the detailed descriptionof specific embodiments presented herein.

FIG. 1 shows a top view of the residual air reduction air device of thepresent disclosure. The bump surface 10, alignment sides 11 a, 11 b, 11c, and 11 d, bump angle 13, attachment flange 12 are shown; and bump top20;

FIG. 2 shows drawings of the residual air reduction air device of thepresent disclosure. FIG. 2A is a top view of the residual air reductionair device of the present disclosure. FIG. 2B is a side view of theresidual air reduction air device with a perspective of an attachmentslot 14. FIG. 2C is a 3D drawing of the residual air reduction deviceshowing the bump surface 10, alignment sides 11, attachment flange 12,and attachment slot 14;

FIG. 3 graphically represents the chunk Particle Size Distribution (PSD)into a 100 gram sample for the chunk component of a pouch packagedproduct. As represented, the sample chunk shape was irregular,discontinuous ropes. The height and width are given by the nozzle (3×13mm) and most of the chunks have a length of 20 mm;

FIG. 4 shows six residual air reducing devices evaluated forperformance; FIG. 4a has first alignment side 11 a that is 20 mm inlength, a bump 10 having a 60° bump angle over a 17 mm rise, a secondalignment side 11 b that is 20 mm in length, a third alignment side 11 cthat is 50 mm in length, and a fourth alignment side 11 d that is 37 mmin length; FIG. 4b has first alignment side 11 a that is 20 mm inlength, a bump 10 having a 45° bump angle over a 30 mm rise, a secondalignment side 11 b that is 20 mm in length, a third alignment side 11 cthat is 50 mm in length, and a fourth alignment side 11 d that is 50 mmin length; FIG. 4c has first alignment side 11 a that is 20 mm inlength, a bump 10 having a 30° bump angle over a 52 mm rise, a secondalignment side 11 b that is 20 mm in length, a third alignment side 11 cthat is 50 mm in length, and a fourth alignment side 11 d that is 72 mmin length; FIG. 4d has first alignment side 11 a that is 20 mm inlength, a bump 10 having a 60° bump angle over a 30 mm rise, a secondalignment side 11 b that is 20 mm in length, a third alignment side 11 cthat is 70 mm in length, and a fourth alignment side 11 d that is 50 mmin length; FIG. 4e has first alignment side 11 a that is 20 mm inlength, a bump 10 having a 30° bump angle over a 30 mm rise, a secondalignment side 11 b that is 20 mm in length, a third alignment side 11 cthat is 37 mm in length, and a fourth alignment side 11 d that is 50 mmin length; FIG. 4f has first alignment side 11 a that is 20 mm inlength, a bump 10 having a 30° bump angle over a 52 mm rise, a thirdalignment side 11 c that is 50 mm in length, and a fourth alignment side11 d that is 52 mm in length;

FIG. 5 graphically illustrates the performance of the devices of FIG. 2in relation to residual air remaining in the pouch package for 100pouches evaluated/device shape (50 pouches left/50 pouches right). Inorder from left to right, the tested devices were a control, the deviceof FIG. 4a , the device of FIG. 4b , the device of FIG. 4c , the deviceof FIG. 4e , the device of FIG. 4d , and the device of FIG. 4 f;

FIG. 6 graphically illustrates the performance of one or more devices ofFIG. 2 in relation to residual air remaining in the pouch package for100 pouches evaluated/device shape and number (50 pouches left/50pouches right). In order from left to right, the tested devices were acontrol, the device of FIG. 4a , the device of FIG. 4b , the device ofFIG. 4c , the device of FIG. 4e , the device of FIG. 4d , twosequentially placed devices of FIG. 4e , the device of FIG. 4f , and twosequentially placed devices of FIG. 4 f;

FIG. 7 graphically illustrates the performance of two sequentiallyplaced devices of FIG. 4e in comparison to one device of FIG. 4e for 100pouches evaluated/device number (50 pouches left/50 pouches right); and

FIG. 8 is a drawing of a TT9 machine illustrating the multiple stationspresent in a pouch-filling process and illustrating a preferred deviceof the present disclosure.

DETAILED DESCRIPTION

In accordance with the present disclosure, a device for reducingresidual air in a pouch package of a product during manufacturing andmethods of using such device have been discovered. In particular, thedevice of the disclosure provides a means to reduce the residual air ina pouch package with minimal alteration to the manufacturing line orprocess in place. For example, in some embodiments, a residual airreduction device according to the present disclosure is useful forreducing a residual air content in a package, such as a pouch package,that contains a finished product. In certain embodiments, the reductionof residual air content that is effected by the residual air reductiondevice of the present disclosure is accomplished prior to sealing thepackage. Accordingly, use of a residual air reduction device of thepresent disclosure is effective for reducing the incidence of oxidationof a finished product packaged in a pouch that is contacted at leastonce, either directly or indirectly, by the residual air reductiondevice.

For example, in some embodiments, a residual air reduction deviceaccording to the present disclosure is useful for reducing a residualair content in a package, such as a pouch package, that contains afinished product. In certain embodiments, the reduction of residual aircontent that is effected by the residual air reduction device of thepresent disclosure is accomplished prior to sealing the package.Accordingly, use of a residual air reduction device of the presentdisclosure is effective for reducing the incidence of oxidation of afinished product packaged in a pouch that is contacted at least once,either directly or indirectly, by the residual air reduction device.

The details of one or more embodiments of the presently-disclosedsubject matter are set forth in this document. Modifications toembodiments described in this document, and other embodiments, will beevident to those of ordinary skill in the art after a study of theinformation provided in this document. The information provided in thisdocument, and particularly the specific details of the describedexemplary embodiments, is provided primarily for clearness ofunderstanding and no unnecessary limitations are to be understoodtherefrom. In case of conflict, the specification of this document,including definitions, will control.

The presently-disclosed subject matter is illustrated by specific butnon-limiting examples throughout this description. The examples mayinclude compilations of data that are representative of data gathered atvarious times during the course of development and experimentationrelated to the present invention(s). Each example is provided by way ofexplanation of the present disclosure and is not a limitation thereon.In fact, it will be apparent to those skilled in the art that variousmodifications and variations can be made to the teachings of the presentdisclosure without departing from the scope of the disclosure. Forinstance, features illustrated or described as part of one embodimentcan be used with another embodiment to yield a still further embodiment.

All references to singular characteristics or limitations of the presentdisclosure shall include the corresponding plural characteristic(s) orlimitation(s) and vice versa, unless otherwise specified or clearlyimplied to the contrary by the context in which the reference is made.

All combinations of method or process steps as used herein can beperformed in any order, unless otherwise specified or clearly implied tothe contrary by the context in which the referenced combination is made.

While the following terms used herein are believed to be well understoodby one of ordinary skill in the art, definitions are set forth tofacilitate explanation of the presently-disclosed subject matter.

Unless defined otherwise, all technical and scientific terms used hereinhave the same meaning as commonly understood by one of ordinary skill inthe art to which the presently-disclosed subject matter belongs.Although any methods, devices, and materials similar or equivalent tothose described herein can be used in the practice or testing of thepresently-disclosed subject matter, representative methods, devices, andmaterials are now described.

Following long-standing patent law convention, the terms “a”, “an”, and“the” refer to “one or more” when used in this application, includingthe claims. Thus, for example, reference to “an alignment side” includesa plurality of such alignment sides, and so forth.

Unless otherwise indicated, all numbers expressing quantities,properties, and so forth used in the specification and claims are to beunderstood as being modified in all instances by the term “about”.Accordingly, unless indicated to the contrary, the numerical parametersset forth in this specification and claims are approximations that canvary depending upon the desired properties sought to be obtained by thepresently-disclosed subject matter.

As used herein, the term “about,” when referring to a value or to anamount of mass, weight, time, volume, concentration or percentage ismeant to encompass variations of in some embodiments ±50%, in someembodiments ±40%, in some embodiments ±30%, in some embodiments ±20%, insome embodiments ±10%, in some embodiments ±5%, in some embodiments ±1%,in some embodiments ±0.5%, and in some embodiments ±0.1% from thespecified amount, as such variations are appropriate to perform thedisclosed method.

As used herein, ranges can be expressed as from “about” one particularvalue, and/or to “about” another particular value. It is also understoodthat there are a number of values disclosed herein, and that each valueis also herein disclosed as “about” that particular value in addition tothe value itself. For example, if the value “10” is disclosed, then“about 10” is also disclosed. It is also understood that each unitbetween two particular units are also disclosed. For example, if 10 and15 are disclosed, then 11, 12, 13, and 14 are also disclosed.

I. Devices

As shown in FIGS. 1, 2, and 4, the residual air reduction device of thepresent disclosure includes a first bump surface 10, one or morealignment sides, such as first alignment side 11 a, second alignmentside 11 b, third alignment side 11 c, and fourth alignment side 11 d, atop 20, and optionally an attachment flange 12. The bump surface 10contacts the pouch package, either directly or indirectly, as the pouchpackage passes the device during a manufacturing process. Such contactallows a product contained within the package to settle, therebyreleasing air trapped within the product and/or within the productmatrix. The contact may also displace a portion of the air in the headspace of the pouch.

At least two of the alignment sides 11 a and 11 b are adjacent to thebump surface 10 such that a partial rhombus-like and/or a partialrectangular-like shape is formed by the alignment sides 11 and the bumpsurface 10. The residual air reduction device may have more than onealignment side 11. The residual air reduction device may have 2, 3, 4,5, 6, 7, 8, or more alignment sides 11. Preferably, the device has 3 or4 alignment sides 11.

The residual air reduction device generally includes a first alignmentside and a second alignment side. In some embodiments, the firstalignment side is adjacent to and/or connected to the bump surface.Likewise, in some embodiments, the second alignment side is adjacent toand/or connected to the bump surface. Accordingly, in certainembodiments, the bump surface is adjacent to one or more of thealignment sides. In some aspects, the bump surface spans between thefirst and second alignment sides, but in some aspects, the bump surfacespans between the first and third alignment sides. The residual airreduction device also generally includes a third alignment side. Asnoted above, the third alignment side connects the bump surface to analignment side that is not the second alignment side, or it can connectthe second alignment side to one or more additional alignment sides,such as, for example, a third alignment side, a fourth alignment side, afifth alignment side, a sixth alignment side, a seventh alignment sideand/or an eighth alignment side.

Suitable dimensions of the device are customizable, and a skilledartisan will recognize that the dimensions may vary from those disclosedherein. By way of example, without limitation, suitable alignment side11 lengths may be between 5 mm and 100 mm or more. In some embodiments,the alignment side 11 length is about 5, 10, 15, 20, 25, 30, 35, 40, 45,50, 55, 60, 65, 70, 75, 80, 85, 90, 95, 100 mm or more. In someembodiments, each of the alignment sides have a different length. Inother embodiments, at least two of the alignment sides have equallengths. In some preferred forms, the first alignment side 11 a and thethird alignment 11 c side have equal or substantially equal lengths. Inother embodiments, the first alignment side 11 a is longer than thethird alignment side 11 c. In other embodiments, the third alignmentside 11 c is longer than the first alignment side 11 a. In someembodiments, the first alignment side 11 a is longer than the secondalignment side 11 b. In some embodiments, the third alignment side 11 cis longer than the second alignment side 11 b. In some embodiments, thesecond alignment side 11 b and a fourth alignment side 11 d have equallengths. In other embodiments, the second alignment side 11 b is longerthan a fourth alignment side 11 d. In other embodiments, a fourthalignment side 11 d is longer than the second alignment side 11 b. Ascan be appreciated, the variation in alignment side lengths is infiniteas each can be individually-sized for a particular application.

In some aspects, the first alignment side 11 a is about 5, 6, 7, 8, 9,10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27,28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45,46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59, 60, 61, 62, 63,64, 65, 66, 67, 68, 69, 70, 71, 72, 73, 74, 75, 76, 77, 78, 79, 80, 81,82, 83, 84, 85, 86, 87, 88, 89, 90 mm or more in length. Preferably, thefirst alignment side 11 a is between about 5 mm and 35 mm, morepreferably between about 10 mm and 30 mm, still more preferably betweenabout 15 mm and 25 mm, and most preferably about 20 mm in length.

In some aspects, the bump surface 10 has a length between 5 mm and 100mm. Preferably, the bump surface has a length between about 10 mm to 65mm, more preferably between about 15 mm to 58 mm, still more preferablybetween about 20 mm and 50 mm, and even more preferably between about 25mm and 42 mm.

In some aspects, the second alignment side 11 b is about 5, 6, 7, 8, 9,10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27,28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45,46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59, 60 mm or more inlength. Preferably, the second alignment side 11 b is between 10 mm and50 mm, more preferably between about 15 mm and 30 mm, and is mostpreferably about 20 mm in length.

In some aspects, the third alignment side 11 c is between about 5 mm and100 mm, including all lengths therebetween, more preferably betweenabout 10 mm and 90 mm, still more preferably between about 15 mm and 85mm, even more preferably between about 20 mm and 80 mm, still morepreferably between about 25 mm and 75 mm, even more preferably betweenabout 30 mm and 70 mm, and most preferably between about 40 mm and 60mm.

In some embodiments, a fourth alignment side 11 d is included in theresidual air reduction device. In such embodiments, the fourth alignmentside 11 d is about 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18,19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36,37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54,55, 56, 57, 58, 59, 60, 61, 62, 63, 64, 65, 66, 67, 68, 69, 70, 71, 72,73, 74, 75, 76, 77, 78, 79, 80, 81, 82, 83, 84, 85, 86, 87, 88, 89, 90,91, 92, 93, 94, 95, 96, 97, 98, 99, 100 mm or more in length.Preferably, the fourth alignment side 11 d is between about 5 mm and 100mm, more preferably between about 10 mm and 95 mm, still more preferablybetween about 15 and 90 mm, even more preferably between about 20 and 85mm, still more preferably between about 25 mm and 80 mm, even morepreferably between about 30 mm and 75 mm, and most preferably betweenabout 35 mm and 70 mm.

The width of the residual air reducing devices of the present disclosureis a width capable of provided a rigid and stable device. Suitablewidths provide a device capable of numerous package contacts with littleto no wear. Such widths include those ranging from 5 mm to 100 mm. Insome aspects the width, or thickness, is about 5, 6, 7, 8, 9, 10, 11,12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29,30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47,48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59, 60, 61, 62, 63, 64, 65,66, 67, 68, 69, 70, 71, 72, 73, 74, 75, 76, 77, 78, 79, 80, 81, 82, 83,84, 85, 86, 87, 88, 89, 90, 91, 92, 93, 94, 95, 96, 97, 98, 99, 100 mmor more in width, or thickness. Preferably, the width, or thickness,ranges from about 10 mm to 80 mm, more preferably between about 15 mmand 70 mm, still more preferably between about 15 mm and 50 mm, and evenstill more preferably between about 20 mm and 45 mm. In some aspects,the width is preferably about 10 mm, 15 mm, 20 mm, 25 mm, 30 mm, 35 mm,or 40 mm, or between 10 mm and 40 mm, or between 15 mm and 35 mm, orbetween 20 mm and 35 mm. In some aspects, the width is preferably about34 mm.

The residual air reduction device also includes a bump angle 13. Thebump angle 13 is the angle formed by the bump surface 10 between a lineperpendicular to the termination of the first alignment side 11 a at thebump surface 10 and the second alignment side 11 b. The bump angle 13may be customized to control the impact of the pouch package with thebump surface 10, as well as the reduction in residual air. Preferably,the bump angle 13 measures about 15°, 20°, 25°, 30°, 35°, 40°, 45°, 50°,55°, 60°, 65°, 70°, or 80°, or any angle therebetween. In some aspects,the bump angle 13 is about 16°, 17°, 18°, 19°, 20°, 21°, 22°, 23°, 24°,25°, 26°, 27°, 28°, 29°, 30°, 31°, 32°, 33°, 34°, 35°, 36°, 37°, 38°,39°, 40°, 41°, 42°, 43°, 44°, 45°, 46°, 47°, 48°, 49°, 50°, 51°, 52°,53°, 54°, 55°, 56°, 57°, 58°, 59°, 60°, 61°, 62°, 63°, 64°, 65°, 66°,67°, 68°, 69°, 70°, 71°, 72°, 73°, 74°, or 75°. In some aspects, thebump angle 13 is between 15° and 60°. In some aspects, the bump angle 13is between 25° and 50°. In some aspects, the bump angle 13 is preferablybetween about 25° and 35°, and is preferably about 30°.

The residual air reduction device may include an attachment device orattachment means, such as an attachment flange 12, attachment slot orgroove 14, or any combination thereof. The attachment device or means isused to attach the device within the manufacturing line. Suitableattachment devices or means include any attachment device or means knownin the art. By way of example, without limitation, attachment flangesmay include an attachment void to allow, for example, attachment of anut and/or a bolt. Further, attachment devices or means may be removableor permanent. For example, the attachment devices or means may bepermanently fixed to or even welded to a machine in a manufacturing lineor it may be removable by unscrewing, unsnapping, releasing detents, orthe like.

One particular embodiment is illustrated in FIG. 8, which provides arepresentation of a TT9 rotatory machine including a pouch magazine 110,printer station 112, pouch opener 114, air nozzle 116, chunk funnel 118,filling nozzle 120, gravy tank 122, multiple sealing bars 124, 126,cooling bar 128, conveyor 130, a location or position 132 to place adevice or bump and a number of pouches 134, each having a top 136 andbottom 138. In some preferred forms, there will be multiple locations orpositions to place devices and/or bumps, according to the presentdisclosure, in the processing line.

II. Methods

The present disclosure provides methods of reducing residual air inpackages, such as pouch packages, during a manufacturing process. Themethods include employing at least one residual air reducing device ofthe present disclosure in a manufacturing line. In some embodiments, asingle device of the present disclosure is employed in a manufacturingline. In some embodiments, two or more devices of the present disclosureare employed in a manufacturing line. A suitable number of devices ofthe present disclosure employed in the manufacturing line is about 1, 2,3, 4, 5, 6, 7, 8, 9, 10 or more. Preferably, 1 to 2 devices are employedin a manufacturing line in an embodiment of the present disclosure. Morepreferably, in other embodiments, 2 or more devices are employed in amanufacturing line.

The methods of the disclosure include employing one or more reducingdevices at a specific point in the manufacturing line to maximizeresidual air reduction. In some embodiments, the device is employedfollowing a pouch filling step. In some embodiments, the device isemployed prior to a package sealing step. In some embodiments, thedevice is employed following one or more pouch filling steps and/orprior to one or more package sealing steps.

The methods of the disclosure include employing the one or more residualair reducing devices at one or more specific package contact points tomaximize residual air reduction. In some embodiments, the device ispositioned to contact the package at one or more points along the bottomthird of the package. In some embodiments, the device is positioned tocontact the package along the middle third of the package. In someembodiments, the device is positioned to contact the package along thetop third of the package. In some embodiments, the device is positionedto contact the package at a point in line with the filled product. Insome embodiments, the device is positioned to contact the package at apoint in line with the head space of the package. The methods includepositioning at least one device in line with the filled product and atleast one device in line with the head space of the package. A skilledartisan will recognize that the position of the device in relation topackage contact may depend upon the viscosity of the filled product andtype of product.

The methods of the disclosure include reducing the residual air in apackaged product, such as a pouch packaged product. In some embodiments,the residual air is reduced by at least 5% in comparison to a pouchpackaged product manufactured without the use of the residual airreduction device described herein. And in certain embodiments, theresidual air is reduced by about 10-100%. In further embodiments, theresidual air is reduced by 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16,17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34,35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52,53, 54, 55, 56, 57, 58, 59, 60% or more. In a particular embodiment,preferably, the residual air is reduced by at least 20-40%, and inanother embodiment, the residual air content is reduced preferably by atleast 50%-60%. A skilled artisan will recognize that the removal ofresidual air is dependent on several variables, such as, for example,product viscosity, chunk size, chunk and gravy/jelly ratio, net content,pouch configuration, and/or filling speed.

In some aspects, the methods of the disclosure include reducing theamount and/or content of residual air in a pouch packaged product sothat less than 8 cubic centimeters (cc) of residual air is remaining inthe final package after sealing. In some embodiments, the residual airis reduced so that about 0.1 to 10 cc of residual air is remaining inthe final package after sealing. In certain embodiments, the residualair content is reduced to about 0.1, 0.2, 0.3, 0.4, 0.5, 0.6, 0.7, 0.8,0.9, 1.0, 1.1, 1.2, 1.3, 1.4, 1.5, 1.6, 1.7, 1.8, 1.9, 2.0, 2.1, 2.2,2.3, 2.4, 2.5, 2.6, 2.7, 2.8, 2.9, 3.0, 3.1, 3.2, 3.3, 3.4, 3.5, 3.6,3.7, 3.8, 3.9, 4.0, 4.1, 4.2, 4.3, 4.4, 4.5, 4.6, 4.7, 4.8, 4.9, 5.0,5.1, 5.2, 5.3, 5.4, 5.5, 5.6, 5.7, 5.8, 5.9, 6.0, 6.5, 7.0, 7.5, 8.0,8.5, 9.0, 9.5, or 10.0 cc remaining in the final package.

By way of example, without limitation, a pouch packaged using themethods of the disclosure has a reduced residual air content compared tothe same sized pouch packaged without the methods of the disclosure. Forinstance, in an embodiment, a standard 50 g final sealed package that isproduced using the methods of the disclosure may have at least 3 cc lessof residual air compared to a 50 g pouch packaged and sealed withoutusing the methods of the disclosure. In another embodiment, a standard85 g final sealed package that is produced via the methods of thedisclosure may have at least 5 cc less of residual air compared to a 85g pouch that is packaged without using the methods of the disclosure.Likewise, a 100 g pouch that is a final sealed package producedaccording to the methods of the present disclosure may have at least 8cc less of residual air compared to a 100 g final sealed package thatwas produced and/or sealed without using the methods of the disclosure.Further, a standard 150 g final sealed package that is produced usingthe methods of the present disclosure may include at least 10 cc less ofresidual air compared to a 150 g pouch packaged without using themethods of the disclosure.

A skilled artisan will recognize that the removal of residual air isdependent on several variables such as product viscosity, chunk size,chunk and gravy/jelly ratio, net content, pouch configuration, and/orfilling speed.

EXAMPLES

The following examples are simply intended to further illustrate andexplain the present disclosure. The disclosure, therefore, should not belimited to any of the details in these examples.

Example 1: General Pouch Package Fill Process

A general process for filling pouch packaged products includes openingthe pouch, filling the pouch with the product, steam injecting the pouchto remove air from the head space, and sealing the pouch. In thisprotocol, the mechanism for removing air is primarily focused ondisplacing the portion contained in the head space. Nevertheless, airwill also get naturally trapped within the product matrix. Injectingsteam into the pouch is not effective for removing air trapped in aproduct matrix from the package. It is within this gap that the presentdisclosure decreases the residual air level.

The general process for filling pouch packaged products described above,without use of a device of the present disclosure, was used for thecontrol pouch herein.

Example 2: Pouch Package Fill Process Using Residual Air ReductionDevice

The residual air reduction device decreases residual air levels bysmoothly allowing the product matrix to adequately settle to the bottomof the pouch package, thereby releasing additional air trapped within.To achieve residual air reduction, a residual air reduction device isattached in line to a filling machine, just after a product depositingstation and before a steam injection. Taking advantage on the TT9 design(TT9 CWS rotatory machine, manufactured by Toyo Jidoki, Tokyo, Japan),the devices are placed upon the natural path that each pouch willfollow. This ensures that the device gently contacts, or hits, eachpouch, and/or that each pouch contacts the device as it proceeds throughthe filling and sealing process on the machine. This contact enables theadditional air to move from the product matrix to the head space of thepackage. The package is then steam injected to remove the residual airin the head space of the package.

In comparison to control pouches packaged without the residual airreduction device, the amount of residual air in the packages aredecreased by at least 30%. In other words, the residual air in a packageundergoing the methods of the present disclosure and contacting a devicedescribed herein is 30% less than the residual air in a control pouchthat underwent all of the same steps except for contacting a device asdescribed herein. The use of the residual air reduction device is notdependent on product design variables.

Example 3: Product Used to Fill Pouch Package for Residual Air ReducingDevice Analysis

A two-shot filling process was analyzed using the residual air reductiondevice. The product, which was a chunk:gravy (50:50) product, wasdispensed into a pouch in two steps. The first step was filling thechunk component of the product and the second step was filling the gravycomponent of the product. The chunk PSD is shown in FIG. 3, and thegravy viscosity is shown in Table 1. The pouch packaged used was an 85 gvolume pouch with a gusset of 20 mm and a net product content of 75 g.

TABLE 1 Gravy Viscosity. Viscosity Temperature Spindle RPM (cP) Torque(° C.) 2 20 18 0.9 34.9 30 20 1.5 35 50 24 3 35 60 26 3.9 35 100 31.67.9 35

Example 4: Residual Air Reduction Device Shape Evaluation

The shape of the residual air reduction device was evaluated usingvarious devices having varying alignment side numbers, alignment sidelengths, and bump angles. FIG. 4 shows the shapes evaluated for thedevice. Each shape evaluated resulted in reduced residual air in thefinal sealed packaged product (FIG. 5). However, it is noted that, insome embodiments, working with a bump angle over 45° could generatepremature wear to the manufacturing equipment. Also, the hitting forcewith a bump angle over 45° may manipulate the opening of a pouch priorto steam injections such that the pouch is compromised. In certainembodiments, the device including a bump angle of 30° was the mostefficient shape for reducing a residual air content of a product and/orof a pouch, such as a final sealed package and/or final sealed packagedproduct. (FIG. 5). It is understood that other bump angles areeffective, depending on the specific characteristics of a product and/ora product package.

Example 5. Residual Air Reduction Device Number Evaluation

The number of residual air reduction devices positioned between thefilling station and the steam injection station was evaluated. FIG. 6shows the residual air remaining in the final sealed package afterprocessing with or without a residual air reduction device of thedisclosure. The use of multiple devices having either a 30° bump angleor 45° bump angle was also evaluated. Based on this evaluation, twodevices having a bump angle of 30° is more efficient than using only onedevice (FIG. 7) in some embodiments. Further, it was observed thathitting the bottom of the pouch was the most efficient contact position,as contact positions located higher caused product to splatter.

The disclosure illustratively disclosed herein suitably may be practicedin the absence of any element, which is not specifically disclosedherein. It is apparent to those skilled in the art, however, that manychanges, variations, modifications, other uses, and applications to themethod are possible, and also changes, variations, modifications, otheruses, and applications which do not depart from the spirit and scope ofthe disclosure are deemed to be covered by the disclosure.

1. A residual air reduction device for reducing the amount of air in apackage, comprising: a. a bump surface having a first end section and asecond end section; b. a first alignment side connected to the first endsection of the bump surface; c. a second alignment side, wherein thesecond alignment side is connected to the second end section of the bumpsurface; d. a third alignment side, wherein the third alignment sideconnects the second alignment side to another alignment side that is notthe first or second alignment side; e. a bump angle defined as the angleformed between a line perpendicular to the first alignment side and aline parallel to the second alignment side, wherein the bump angleranges from 25° to 65°; and f. an attachment device, wherein theattachment device allows attachment of the residual air reduction deviceto manufacturing equipment.
 2. The residual air reduction device ofclaim 1, wherein the bump angle is selected from 30°, 45°, or 60°. 3.The residual air reduction device of claim 1, wherein the firstalignment side has a length ranging from 30 mm to 80 mm.
 4. The residualair reduction device of claim 1, wherein the second alignment side has alength less than the length of the first alignment side.
 5. The residualair reduction device of claim 1, further comprising a fourth alignmentside connecting the third alignment side with the first alignment side.6. A method of reducing residual air in a package comprising the stepsof: a. at least partially filling the package with product; b.contacting the package with a first residual air reducing device toremove at least some of the air trapped in the product matrix and/orlocated in the head space of the package; and c. at least partiallysealing the pouch package.
 7. The method of claim 6, further comprisingthe step of at least partially opening the package prior to filling thepackage with product.
 8. The method of claim 6, wherein said package isa pouch.
 9. The method of claim 6, wherein air trapped in the productmatrix and air located in the headspace of the package is removed bycontacting the package with a first air reducing device.
 10. The methodof claim 6, wherein the package is completely sealed.
 11. The method ofclaim 6, wherein the residual air remaining in the pouch package is atleast 3 cc less than the residual air remaining in a pouch package thathas not contacted a residual air reducing device but has undergone stepsa and c.
 12. The method of claim 6, wherein the residual air remainingin the pouch package is at least 5% less than the residual air remainingin a pouch package that has not contacted a residual air reducing devicebut has undergone steps a and c.
 13. The method of claim 6, furthercomprising the step of removing additional residual air from the headspace of the package.
 14. The method of claim 13, wherein the removal ofthe additional residual air located in the head space of the package isby steam injection.
 15. The method of claim 13, wherein the residual airremaining in the pouch package is at least 3 cc less than the residualair remaining in a pouch package that has not contacted a residual airreducing device but has undergone steps a and c.
 16. The method of claim6, further comprising contacting the pouch package with a secondresidual air reducing device.
 17. The method of claim 16, wherein thesecond residual air reducing device is positioned such that thecontacting with the second residual air reducing device occurssequentially after contacting the first residual air reducing device.18-19. (canceled)
 20. The residual air reduction device of claim 1,wherein the bump angle is 30°.
 21. The method of claim 6, wherein thecontacting of the first residual air reducing device occurs along thebottom third of a pouch package.
 22. The method of claim 16, wherein thecontacting of the second residual air reducing device occurs along thebottom third of a pouch package. 23-31. (canceled)